WUFI?5

WUFI?5 is a building-physics tool for simulating coupled heat and moisture transport in building envelopes under real climate conditions. It helps architects, engineers, and researchers evaluate durability, energy performance, and indoor comfort by modeling how walls, roofs, and other assemblies behave over time.

Key capabilities:

• Transient hygrothermal simulation of multilayer assemblies (walls, roofs, floors)
• Material database with moisture-dependent properties and support for custom materials
• Import of weather files, including rain, wind, temperature, humidity, and solar radiation
• Risk assessment for condensation, interstitial moisture, and mold growth
• Visualization of temperature, relative humidity, water content, and heat flux
• Scenario comparison to test design options and retrofit strategies

Typical uses:

• Validate vapor control and insulation placement
• Assess retrofit impacts on existing or historic buildings
• Check drying potential after construction moisture or leaks
• Optimize envelope designs for durability and energy efficiency

Note: Features and availability may vary by version; consult the official documentation for exact specifications.

WUFI?5 is developed by Fraunhofer IBP, Holzkirchen, Germany. The most popular version of this product among our users is 5.1.